Electrical Engineer (High-Speed Data Capture) About Mecka AI Mecka AI is building the data infrastructure layer for robotics and embodied AI. We design and deploy next-generation data capture systems that operate in real-world environments and generate high-quality datasets used to train advanced robotic and embodied AI models. Our hardware sits at the intersection of sensors, compute, power, and reliability , and must perform flawlessly in the field. The Role We’re hiring an Electrical Engineer to own the electrical architecture and board-level design of our high-performance data capture devices. This role is about building the nervous system of our hardware — integrating high-performance compute modules into compact, battery-powered form factors while solving real-world challenges around signal integrity, power delivery, thermal constraints, and manufacturability. You will bridge the gap between prototype and product , owning designs from schematic through bring-up, validation, and production. What You’ll Work On Compute Module Integration Design custom carrier boards for high-performance System-on-Modules (SoMs) Break out and route high-speed interfaces from compact compute modules to custom peripherals Support embedded Linux platforms and board bring-up in collaboration with firmware teams High-Speed PCB Design End-to-end ownership of complex rigid-flex and high-density PCBs Route and tune high-bandwidth interfaces including: MIPI CSI-2 (multi-camera arrays) PCIe Gen 3 / Gen 4 USB 3.x / USB-C Manage EMI, crosstalk, and impedance control in dense, space-constrained designs Power Architecture & Battery Systems Architect high-efficiency Power Delivery Networks (PDNs) for AI compute and active sensors Design battery management systems (BMS) for portable devices Implement efficient DC-DC conversion under thermal and power constraints Handle transient load behavior and power sequencing requirements Sensor & Peripheral Integration Lead electrical integration of sensor suites including: CMOS image sensors Time-of-Flight (ToF) LiDAR IMUs Design analog front-ends and low-noise power rails for high-fidelity data capture Bring-Up, Debugging & Validation Own board bring-up, validation, and debug Diagnose signal integrity, power integrity, and timing issues at the physical layer Support field reliability and iteration toward production readiness Who You Are Required Technical Experience Strong experience designing complex PCBs using modern ECAD tools (Altium, Cadence, or similar) Proven experience integrating commercial compute modules / SoMs into custom carrier boards Deep understanding of: High-speed digital design Differential pair routing Impedance control and stack‑up design SI / PI simulation and validation Hands‑on experience debugging hardware using lab instrumentation (oscilloscopes, logic analyzers) Cross-Functional Strength Comfortable working closely with mechanical engineers on thermal and packaging constraints Able to collaborate with firmware and software teams on board bring‑up and system integration Clear communicator of design tradeoffs and technical risks Manufacturing & Compliance Familiarity with EMI / EMC considerations and compliance standards (FCC, CE) Experience with design‑for‑manufacturing (DFM) and production handoff Comfortable iterating designs toward reliability and scale Why This Role Own critical hardware systems used to capture real-world robotics data Design devices that directly impact the quality of next-generation AI models Work on technically challenging problems across compute, sensors, power, and packaging High ownership from early prototype through production deployment Collaborate with a deeply technical, execution-focused team #J-18808-Ljbffr