A leading technology firm in Ottawa is seeking a motivated Process Engineer to optimize assembly processes for Photonic Integrated Circuit products. The ideal candidate has a Bachelor’s degree in mechanical engineering and 2–3 years of relevant experience. Responsibilities include designing wire bonding recipes and conducting reliability testing. Competitive salary range of $71,600 to $114,400 and comprehensive benefits offered.#J-18808-Ljbffr
Photonic Process Engineer: Wire Bonding & Die Attach
CIENA CORPORATION
ottawa, ottawa
Published 27 days ago
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