Job Description As a Principal RF/EM Engineer at Nokia, you will be at the forefront of designing innovative broadband circuits and systems that shape the future of telecommunications. Collaborating within a dynamic, multidisciplinary design team, you will tackle complex challenges in electromagnetic modeling, RF structures, and high-speed ASIC packaging. Your leadership in developing and validating state-of-the‑art designs will drive the development of next‑generation products. The work environment is collaborative and fast‑paced, filled with passionate professionals committed to pushing technological boundaries. You will thrive in a culture that encourages continuous learning, creativity, and teamwork while delivering cutting‑edge solutions that redefine network performance. Join us to make a meaningful impact in shaping the future of connectivity! How You Will Contribute And What You Will Learn Lead the design and development of advanced broadband circuits and ASIC packaging solutions. Conduct electromagnetic modeling and validation of RF structures and IC package transitions. Perform end‑to‑end channel simulations and eye diagram analysis to ensure optimal performance. Guide a multidisciplinary team in creating and verifying proof of concepts and evaluation boards. Oversee substrate selection and detailed modeling of PCB, modules, and interconnects for high‑speed applications. Develop high‑speed test fixtures and calibration kits; execute comprehensive design verification up to 90 GHz. Implement continuous improvements in signal integrity and modeling techniques to enhance modeling accuracy. Collaborate with cross‑functional teams to publish test reports and provide actionable recommendations. Key Skills And Experience You have: M.Sc./Ph.D. in Electrical Engineering with a focus on microwave design Minimum of 5 years of experience in HFSS modeling and ADS Expertise in designing passive structures above 50 GHz Proficient in measurements using VNAs and probing techniques It would be nice if you also had: Experience in Telecom product development Familiarity with PCB, HDBU, and mSAP fabrication techniques Knowledge of Electro‑optics and RF test equipment Proficiency in MATLAB and other simulation tools #J-18808-Ljbffr